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One report claims that all models launching two years from now would feature 3nm chips from TSMC. TSMC to Have Various 3nm Tiers Planned for the Future, Less Expensive iPhone 16 Models May Use First-Generation 3nm Chips in 2024 A Morgan Stanley report covered by Charlie Chan’s team, as shown by Economic Daily News, discusses TSMC’s 3nm expansion ambitions.
Unfortunately, the silicon wafer producer is claimed to be reducing its cutting-edge node manufacturing capacity from 80,000 wafers per month to 60,000 wafers per month. Even so, that is a gigantic production, the most of which will be used by Apple for iPhone processors in 2024. The technological giant had previously been rumoured to switch to TSMC’s 3nm processors for all iPhones in 2024, but here is where most readers may become confused.
TSMC has numerous 3nm levels ready for clients like Apple, with each iteration improving on the previous one. Assuming the company’s plans to release four new iPhone models go as planned, the less costly iPhone 16 and iPhone 16 Plus will almost certainly employ a SoC mass-produced on the first-generation 3nm technology, while the ‘Pro’ range might switch to the more power-efficient second-generation type.
Apple is speculated to employ TSMC’s second-generation 3nm process to mass produce the M3 and A17 Bionic, with both chipsets scheduled to arrive next year, but the Cupertino juggernaut may save the new manufacturing process for the A18 Bionic, which is expected to launch in 2024.
Of course, all of this is contingent on TSMC’s ability to continue producing the same number of wafers every month without encountering production bottlenecks, as companies like as Qualcomm and MediaTek will also want to employ that technology for their own mobile silicon.
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